WAFER-LEVEL PACKAGING CONFERENCE. ANNUAL INTERNATIONAL. 10TH 2013. (IWLPC 2013)

WAFER-LEVEL PACKAGING CONFERENCE. ANNUAL INTERNATIONAL. 10TH 2013. (IWLPC 2013)

Item #:
020399
Our Price: $160.00
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Details

  • Title: 10th Annual International Wafer-Level Packaging Conference (IWLPC 2013)
  • Date/Location: Held 6-7 November 2013, San Jose, California, USA.
  • ISBN: 9781629934532
  • Pages: 227 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Surface Mount Technology Association (SMTA)
  • POD Publisher: Curran Associates, Inc. ( Mar 2014 )

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Tab 4

 
  • Title: 10th Annual International Wafer-Level Packaging Conference (IWLPC 2013)
  • Date/Location: Held 6-7 November 2013, San Jose, California, USA.
  • ISBN: 9781629934532
  • Pages: 227 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Surface Mount Technology Association (SMTA)
  • POD Publisher: Curran Associates, Inc. ( Mar 2014 )