Details
- Title: 2026 Asia-Pacific International Symposium and Exhibition on Electromagnetic Compatibility (APEMC 2026)
- Date/Location: Held 4-7 May 2026, Kuala Lumpur, Malaysia.
- IEEE #: CFP2678I-POD
- ISBN: 9798331566609
- Pages: 711 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2026 )
Description
Members/Attendees
Tab 4
- Title: 2026 Asia-Pacific International Symposium and Exhibition on Electromagnetic Compatibility (APEMC 2026)
- Date/Location: Held 4-7 May 2026, Kuala Lumpur, Malaysia.
- IEEE #: CFP2678I-POD
- ISBN: 9798331566609
- Pages: 711 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2026 )